What SK Hynix is up to now

New 09-25: A SOLIDIGM IPO WEIGHED. Reuters reported on 09-25 that SK Hynix's US NAND and SSD subsidiary Solidigm is weighing a US IPO as soon as next year at up to $150bn, raising about $15bn, which would be the largest US chip listing; banks pitched for roles this week. New 09-04: deferred again, on its own clock. A Form 6-K filed with the SEC says "no matters have been determined" on a rumored 5-10 trillion won ($3.6-7.2bn) pre-IPO capital raise for Solidigm, its US NAND subsidiary — the second such non-answer, after an 08-06 6-K that denied a decision and promised an update within a month. Today met that deadline by pushing the disclosure commitment out to 2026-12-04. The raise traces to an 08-05 Korea Economic Daily report. Read as: a memory maker keeping a capital-markets option open through the squeeze without committing to it, and disclosing on a schedule of its own choosing rather than on events. Note this is the NAND arm, not the HBM/DRAM business the shortage thread turns on. New 08-23: showed i-HBM packaging at Hot Chips 2026 (claimed >30% lower thermal resistance) and — the newsworthier half — disclosed it is EVALUATING INTEL'S EMIB packaging alongside TSMC's CoWoS for future HBM-logic integration. That points at a possible SK hynix-Intel packaging tie-up in a market CoWoS currently defines, and is the first concrete sign of a second source for advanced packaging. Week of 2026-08-10: No new structural development this week — the only movement was a +8% intraday price pop (08-13, alongside Micron +6%, SanDisk +15%) explicitly read as CoreWeave's earnings validating the memory-demand "monetization phase" story, flagged in-digest as price action only. The standing structural picture (recorded 08-07 — ~55% HBM share, first through Nvidia's HBM4 qualification, an all-time-record but consensus-missing Q2 operating profit of ₩60.5426T/+557% YoY that still triggered a -9.61% close and a second KOSPI circuit breaker, the AMEC equipment-testing hedge, the early-stage Chongqing packaging-plant stake-sale talks) is unchanged across the full 08-10→08-15 window. The Q2 print post-dates the board's 07-25 axes derivation and has not been rolled into `axes_num`. New 08-13: SK Hynix ran +8% intraday (alongside Micron +6%, SanDisk +15%) as CoreWeave's earnings read as the 'monetization phase' validation Wall Street wanted for the memory-demand story — flagged in- digest explicitly as price action only, no new structural development against the standing picture. That standing picture (recorded 08-07) holds: ~55% HBM share, first through Nvidia's HBM4 qualification, the Q2 print that was an all-time-record operating profit (₩60.5426T, +557% YoY) that still missed consensus and got punished with a -9.61% close and a second KOSPI circuit breaker, the AMEC equipment-testing hedge, and the early-stage Chongqing packaging-plant stake-sale talks.

as of 2026-09-25