$10.5B — 2026 capex raised to $10.5B (from a prior $8.5B forecast); ~$4B to new fabs/infrastructure, ~$6.5B to production equipment for LEAP (Leading-Edge Advanced Packaging), mainstream packaging, and test capacity (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
$10.5B — 2026 capex raised to $10.5B (from a prior $8.5B forecast); ~$4B to new fabs/infrastructure, ~$6.5B to production equipment for LEAP (Leading-Edge Advanced Packaging), mainstream packaging, and test capacity (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
Sourced figures 1
- TrendForce ASE raises 2026 capex to a record $10.5B, LEAP revenue already exceeded a $3.5B target for 2026
the working
Basis
$10.5B — 2026 capex raised to $10.5B (from a prior $8.5B forecast); ~$4B to new fabs/infrastructure, ~$6.5B to production equipment for LEAP (Leading-Edge Advanced Packaging), mainstream packaging, and test capacity (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
Hypothesized recipients 2
- ASE Technology (advanced packaging/test capacity construction (LEAP program)) → Hung Ching Constructionhypothesis
$163.4M — Hung Ching Construction sold ASE the existing K18 facility for approximately NT$5.26B (~$163.4M); Hung Ching also holds a 77.76% stake in the K28 plant joint venture versus ASE's 22.24% (ASE contributed the land, Hung Ching funds the construction).
- ASE Technology (advanced packaging/test capacity construction (LEAP program)) → WUS Printed Circuithypothesis
Joint facility announced with WUS Printed Circuit in Nanzih Park (~113,000 sqm, completion targeted September 2029) for FOCoS/FC BGA substrate production -- a co-investment partnership; no dollar figure attributed to WUS specifically.
A claim is one metric we assert about a node — the value is the summary, this page is the receipt. Sourced from kestrel; supersedes-history not yet shown. Back to Research · Q1.