Micron Technology → unnamed vendor(s) — memory & storage (HBM advanced-packaging facility construction)
$7.0B — SG$9.5B (~$7B) HBM advanced-packaging facility, through the end of the decade and beyond (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
$7.0B — SG$9.5B (~$7B) HBM advanced-packaging facility, through the end of the decade and beyond (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
Sourced figures 1
- Micron company release (EIN Presswire/GlobeNewswire wire reproduction) SG$9.5B (~$7B) HBM advanced-packaging facility in Singapore
the working
Basis
$7.0B — SG$9.5B (~$7B) HBM advanced-packaging facility, through the end of the decade and beyond (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
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