TSMC → unnamed vendor(s) — compute silicon & systems (advanced packaging construction (CoWoS — distinct facet from tsmc/foundry-construction))
derived range — 10-20% of TSMC's $60-64B FY2026 capex guidance, bucketed with testing and mask-making, not a company-stated standalone figure (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
derived range — 10-20% of TSMC's $60-64B FY2026 capex guidance, bucketed with testing and mask-making, not a company-stated standalone figure (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
Sourced figures 1
- TSMC Q2 2026 earnings call transcript FY2026 capex raised to $60-64B; 70-80% advanced process, ~10% specialty, 10-20% advanced packaging/testing/mask-making/other
the working
Basis
derived range — 10-20% of TSMC's $60-64B FY2026 capex guidance, bucketed with testing and mask-making, not a company-stated standalone figure (paid to unnamed vendors/contractors — this source doesn't disclose who specifically got the money)
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